MediaTek's Dimensity CX C10 Max Puts Up to 55 TOPS in Fanless Laptops

MediaTek's first Dimensity CX chip pairs a 3nm octa-core design with an NPU rated at up to 55 TOPS for fanless ultraportables, starting with an upcoming premium Googlebook. No price or ship date was…

Sep 21, 2026
3 min read
Technobezz
MediaTek's Dimensity CX C10 Max Puts Up to 55 TOPS in Fanless Laptops

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MediaTek has introduced the Dimensity CX C10 Max, the first chip in a new laptop-focused line it calls Dimensity Compute Experiences, or CX. The company announced the processor from Hsinchu, Taiwan, on Sept. 21, 2026, and positions it as the flagship of that family. MediaTek says the chip is built for an upcoming premium ultraportable Googlebook, making it the company's clearest push yet into AI-first laptops.

The headline number is AI throughput: the MediaTek NPU 890 is rated at up to 55 TOPS, and MediaTek says it is designed to run Gemini Intelligence features. The chip is manufactured on TSMC's 3nm process, which MediaTek says allows for thinner, lighter, fanless laptop designs. MediaTek did not disclose clock speeds, memory or storage types, or any performance comparisons against its earlier chips.

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Beyond the NPU, the C10 Max carries an octa-core CPU built entirely from big cores and an 11-core GPU. Connectivity includes Wi-Fi 7 with speeds up to 7.3Gbps and dual-engine Bluetooth 6.0. A MediaTek Imagiq 1090 image signal processor handles cameras up to 32MP.

MediaTek left several buyer questions unanswered. There is no price, no ship date, and no battery-life figure in the announcement, and no device makers are named beyond the Googlebook reference. A product page is live on MediaTek's site for the C10 Max.

The launch lands six days after MediaTek announced the Dimensity 9600 Pro, a smartphone chip it claimed as the first on a 2nm process node. That chip's NPU 1090 was said to run models up to 30 billion parameters, and it was the first Dimensity part with LPDDR6 memory and UFS 5.0 storage. MediaTek's own lab tests put the 9600 Pro's multi-core power draw 61% below the prior generation, with single-core gains of up to 17% and multi-core gains of up to 15%. Phones using it were expected this quarter, with no date or price given at the time.

The C10 Max also follows MediaTek's June work with Samsung, where the two companies said they ran what MediaTek billed as an industry first in 3Tx 5-layer uplink testing, using the M90 5G modem platform. MediaTek describes itself as a fabless semiconductor designer whose chips power more than 2 billion connected devices each year. Its shares trade on the TWSE under ticker 2454.

Vince Hu, Senior Vice President & General Manager of Data Center & Computing Business at MediaTek, said the chip is aimed at the next wave of intelligent computing and pairs flagship performance with power-efficient processing. He added that bringing these capabilities to Googlebook builds on the company's Android computing work and its long collaboration with Google. What the announcement does not say is when any of it reaches shelves.

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