Xiaomi Corp. launched the Xring O3 system-on-a-chip for its marquee devices, a move that pressures Qualcomm Inc. and MediaTek Inc. after years of relying on those suppliers for the key component.
The Beijing-based company announced the chip in a post on Chinese social media platform Weibo, touting more power-efficient image processing and better artificial intelligence capabilities from its in-house semiconductor design work.
The Xring O3 is built using a 3-nanometer fabrication process, according to Xiaomi founder Lei Jun. The chip will debut in the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max in September, and it succeeds last year's Xring O1.
Xiaomi says the Xring O3 scored 5,228,014 in the AnTuTu V11 benchmark.
Having an in-house chip for its flagship products would enhance Xiaomi's bargaining position with suppliers and boost its consumer appeal in a fiercely competitive market. The company has contracted Taiwan Semiconductor Manufacturing Co. to manufacture the chips, and it continues developing its own silicon to gain more control over key components and reduce reliance on chip suppliers such as Qualcomm and MediaTek.
The 3-nanometer node puts Xiaomi's design close to the process used for Apple Inc.'s most recent A19 Pro chips and ahead of rival Huawei Technologies Co.'s in-house designs. Xiaomi is not subject to sanctions preventing it from contracting with international suppliers, unlike Huawei, which turned to self-developed Kirin processors after US restrictions cut it off from global suppliers including Qualcomm.
