Reports about Apple's next iPhone chip point to two possible manufacturing changes for the A20 Pro. 9to5Mac says the chip is expected to use TSMC's 2-nanometer process and Wafer-Level Multi-Chip Module packaging.
The move from a 3-nanometer to a 2-nanometer process could give Apple more room to improve performance and power efficiency in a similar chip footprint. The report does not provide confirmed A20 Pro performance figures.
WMCM packaging would integrate components such as the system-on-chip and DRAM at the wafer level before individual chips are cut. The approach can shorten the connection between processing and memory components and may improve thermal behavior, signal integrity, performance, and power use.
The two changes are still based on supply-chain reporting and industry expectations. Apple has not announced the A20 Pro, confirmed which phones would use it, or disclosed performance and efficiency claims.
Current reports associate the chip with the iPhone 18 Pro lineup and Apple's rumored foldable iPhone. Those product names, specifications, and launch plans remain unconfirmed until Apple makes an announcement.
