Qualcomm may adopt Samsung's Heat Pass Block cooling technology for its upcoming Snapdragon 8 Elite Gen 6 processors, according to leaks from Chinese tipster Fixed-Focus Digital. The Weibo post suggests Qualcomm will use HPB on flagship chips scheduled for release later this year.
Samsung developed the Heat Pass Block system for its Exynos 2600 processor, which powers some Galaxy S26 models. The technology uses a copper-based heatsink placed directly on the silicon die, moving RAM away from the SoC to reduce heat traps.
Early data indicates this approach improves thermal resistance by approximately 16%.
The smartphone industry faces thermal limitations as clock speeds approach 5GHz. Traditional vapor chambers and graphite sheets struggle with current thermal demands, particularly with Qualcomm's Snapdragon 8 Elite Gen 5 chips that reportedly consume significantly more power than competitors.
Recent Snapdragon-powered flagships like the OnePlus 15 and realme GT8 Pro have exhibited high temperatures and notable throttling during demanding tasks. Gamers report performance drops during extended sessions, with devices becoming uncomfortably warm to hold.
Some manufacturers have resorted to including cooling fans with Snapdragon 8 Elite Gen 5 phones.
Samsung began shopping HPB technology to external companies approximately two months before this report surfaced. The timeline for integrating the cooling solution into Snapdragon 8 Elite Gen 6 remains tight if Qualcomm aims for a 2026 release.
Semiconductor design cycles typically require months of testing and validation.
Qualcomm normally launches flagship silicon around September. The potential partnership marks a notable shift given Samsung and Qualcomm's history as fierce rivals in the mobile processor market. Both companies have previously collaborated on projects including advanced XR headsets.
The passive nature of HPB means it requires no additional power draw while helping maintain consistent performance during sustained workloads. This contrasts with active cooling systems that introduce battery drain and IP rating complications.
If successfully integrated, HPB technology could allow Snapdragon 8 Elite Gen 6 chips to maintain higher clock speeds for longer periods without thermal throttling. Consumers could see flagship phones that deliver sustained performance without requiring bulky cooling accessories.
Reports suggest some Snapdragon 8 Elite Gen 6 variants may use Samsung's 2nm process while others stick with TSMC's 2nm manufacturing. Moving to a 2nm process helps with efficiency, but lithography alone cannot solve thermal issues caused by aggressive performance targets.
The potential adoption of Samsung's cooling technology highlights the growing importance of effective thermal solutions as mobile processors become increasingly powerful and compact. For Qualcomm, addressing persistent thermal challenges could help maintain its position in the premium Android market.
Whether Qualcomm can successfully integrate HPB technology in time for a 2026 release remains the critical question. The answer will determine if next year's flagship phones run cooler or continue to struggle with thermal constraints.
