Google’s upcoming Pixel 11 could close the security gap with Apple’s iPhones through a new dedicated hardware chip. Leaked details point to a Titan M3 security coprocessor arriving with the Tensor G6 silicon later this year.
Telegram leaker Mystic Leaks reported evidence of the new Titan M3 chip inside Google’s next-generation processor. Codenamed “Google Epic” and running firmware called “longjing,” the hardware would mark Google’s first major security upgrade since introducing the Titan M2 with the Pixel 6 in 2021.
The current Titan M2 handles encryption before device unlock, validates Android OS integrity, and secures biometric data within a protected enclave. Google previously claimed it could withstand sophisticated attacks including laser fault injection, electromagnetic analysis, and voltage glitching.
The M3 iteration is expected to strengthen those defenses further while potentially integrating newer Android security features like automatic theft protection and Identity Check features that prevent unauthorized access to sensitive functions.
Hardware-based security processors create isolated environments separate from main system operations. This approach mirrors Apple’s Secure Enclave architecture that has given iPhones a reputation for strong data protection.
Internal listings suggest the Titan M3 could compete more directly with Apple’s solution.
Tensor G6 production could shift to TSMC's advanced 2nm manufacturing node, following Google's move from Samsung to TSMC for the Tensor G5 chip last year. The smaller process should improve efficiency and thermal performance alongside the security enhancements.
Pixel 11 models are scheduled for an August release based on recent launch patterns. Google may preview some Titan M3 details during its developer-focused I/O conference in May.
