The rumor about Samsung Galaxy S7 is keep on circulating on the Internet. The latest one said this device will have a liquid cooling.
Today, the leaked image of Samsung device, which is suspected as a Galaxy S7 variant, circulates. The image comes from the third party case manufacturer, ITSkin. They can get access to detailed proportions and control layouts to prepare their product line.
From the dimensions, it seems that the device will have 2 variants: Galaxy S7 and S7 Plus. The Galaxy S7 will have dimension 143.37 x 70.8 x 6.94 mm, almost identical with Galaxy S6. The other variant has a dimension 163.32 x 82.01 x 7.82 mm, which is similar to Galaxy Mega 2.
The design of these next gen of Samsung devices is also identical to Galaxy S6, the difference is the home button. It’s changed from the round shape to the rectangular shape. The SIM card slot is removed to the side of the device.
According to the rumors, the Galaxy S7 will be released in January or March 2016 and will have the high end specification, such as Exynos 8890, 3D Touch, liquid cooling, and more.
The other news: JDI To Provide OLED Panel For iPhone In 2018
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