The new rumor said that Samsung Galaxy S7 will use a liquid cooling to overcome the heating issue from the processor. The liquid cooling technology has been used already by Lumia 950 XL and Xperia Z5 to reduce the heat. It makes these devices the first smartphones to implement this technology.
Samsung reportedly has succeeded to create the thinner liquid cooling (0.6mm) and will not make the Galaxy S7 thicker.
This liquid cooling will cover the Exynos 8890 processor, which, according to the rumor will be used on Galaxy S7. The processor will have the amazing performance with the highest Antutu score up to 103,000+, beats the best performance of CPU Kirin 950 Huawei (Antutu score=79,000).
It raises the speculation: “Does it mean Exynos 8890 is hotter than the other processors? Or, does Samsung just want to make it cooler?
Rumors say Samsung Galaxy S7 will be launched in January or March on the Mobile World Congress 2016 event.
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