Major iPhone 7 Chips Will Be Provided With Electro Magnetic Interference Shielding

Apple is planning to use the Electro Magnetic Interference (EMI) Shielding on major iPhone 7 chips, as it was reported by ETNews. It aims to boost the performance of a device and protect users from the electromagnetic wave of the smartphone. The chips that will use EMI shielding are radio frequency (RF), connectivity (wireless LAN, Bluetooth), the application processor (AP), modem, and the other chips.

Previously, the EMI shielding technology has been adopted by Apple for PCB and connector, and currently, they are trying to apply this technology to these chips.

Major iPhone 7 Chips Will Be Provided With Electro Magnetic Interference Shielding

“When EMI Shield technology is applied, unexpected signals that happen due to electromagnetic interference can be prevented. Also, circuit boards can also be assembled more elaborate. When mounting space between the chips is decreased, areas that are left over can be used for batteries and eventually increase times that batteries can last. Major chips’ production costs will increase due to addition of new process.”

Apple will cooperate with StatsChipPac and Amkor –  a South Korean basis company –  to work the EMI shield on iPhone 7.

This is another interesting rumor about iPhone 7, which will probably be released in September. iPhone 7 was reported to have a waterproof feature, will not have a headphone jack, will have dual camera for iPhone 7 plus variant and more. This EMI shielding feature is one of the significant iPhone’s internal hardware development.

Source

The other news: Microsoft Still Needs HTC To Build Windows 10 Mobile Device

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