Apple Adds JCET To Assembly Their SiP Module In 2017

Apple Add JCET to Assembly Their SiP Module in 2017.

JCET ( Jiangsu Changjiang Electronics) will become the new Apple’s partner for 2016 to assembly the System in Package (SiP) of Apple, according to Digitimes report. JCET is a big company in semiconductor packaging field in China, who also has acquired STATS ChipPAC early this year. STATS ChiPAC is one of the companies which has an Apple certification. This can make the cooperation easier.

JCET’s board has approved a plan to spend $200 million to expand production lines for SiP modules. At this moment, Apple partners with two suppliers in making SiP are Murata from Japan and Universal Scientific Industrial (USI) of Taiwan-based Advanced Semiconductor Engineering (ASE).

By adding the manufacturing partner in assembly SiP, it shows the bigger SiP demand for the next year. Currently, Apple uses a SiP design for the Apple Watch and there have been rumored that Apple will make SiP for the iPhone.

Source: DigiTimes

The other news: Sony Has Sold 30 Million Units Of PlayStation 4: What A Sales Surpass!